| 1. | Technology and application of electroless copper plating
化学镀铜及其应用 |
| 2. | Pretreatment of carbon fiber for electroless copper plating
化学镀铜前碳纤维预处理的研究 |
| 3. | Condition optimizing of electroless copper plating for glass fiber
玻璃纤维化学镀复合材料性能研究 |
| 4. | Electroless copper platings
化学浸镀铜 |
| 5. | Application of uniform design in electroless copper plating on al o powder under ultrasonic irradiation
粉末超声化学镀铜工艺中的应用 |
| 6. | Electroless copper plating of non - metallic particles and its effects on strength of sintered friction materials
非金属颗粒镀铜及对烧结摩擦材料强度的影响 |
| 7. | The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs
化学镀铜层的显微结构受基体的显著影响。 |
| 8. | Conductive poly ( ethylene terephthalate ) ( pet ) fabrics were prepared by electroless copper and nickel plating
摘要采用化学镀的方法制备镀铜和镍导电涤纶织物。 |
| 9. | Electroless copper depositing processess are controlled by the kinetics of formal dehyde oxidation reaction , which donate electron for the cathodic reduction of cupric ions
摘要化学镀铜反应受甲醛氧化过程动力学控制，甲醛氧化为铜离子还原提供电子。 |
| 10. | The effect of hydrogen on the ductility of electroless copper deposit is primarily caused by molecular hydrogen contained in voids , particularly the type gb voids
镀层延展性降低的主要原因是由氢气泡的缺陷效应，特别是第三类氢气泡、晶粒边界气泡空穴。 |
